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利用阳离子表面活性剂(十六烷基三甲基溴化铵)胶束与硅源(正硅酸乙酯)的协同组装过程,通过改进的St?ber法制备具有放射状孔道的介孔氧化硅(Mesoporous silica,Sm)微球。结果表明:所得Sm微球粒径在260~480 nm范围,样品的BET比表面积为1 3001 500 m2/g,其内部孔道孔径集中在23 nm。利用原子力显微镜比较了Sm磨料与常规实体氧化硅(Solid silica,Ss)磨料对热氧化硅片的抛光特征。经Sm磨料抛光后,衬底表面粗糙度均方根值RRMS为0.240 nm,表面微观轮廓起伏在±0.70 nm范围内,抛光材料去除率γMRR可达93 nm/min。与Ss磨料相比,Sm磨料有利于降低抛光衬底粗糙度,提高材料去除率,并有效避免出现微划痕等表层机械损伤。
Abstract：The mesoporous silica(Sm) microspheres with radial channels were prepared via a developed St?ber method and the self-assembly of anionic surfactant(cetyltrimethylammonium bromide) micelles with silica precursors(tetraethoxysilane). The results indicate that the particle sizes of the Sm microspheres range from ca. 260 to 480 nm, and the Brunauer-Emmett-Teller specific surface areas are 1 300–1 500 m2/g and the mesochannel sizes are in a range of 2–3 nm. The chemical mechanical polishing characteristics of Sm and solid silica(Ss) particle abrasives for oxidized silicon substrates were investigated by atomic force microscopy. The root-mean-square surface roughness(RMS) of the substrate after polishing with Sm abrasives is 0.240 nm, and the topographical variation is ±0.70 nm and the material removal rate(MRR) is 93 nm/min. Compared to the Ss particles, the as-synthesized Sm particles can be used to further decrease the surface roughness, increase the material removal rate and eliminate the surface mechanical damage.
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基本信息:
DOI：10.14062/j.issn.0454-5648.2016.09.17
中图分类号:TQ127.2;TN305.2
引用信息:
[1]陈爱莲,秦佳伟,陈杨.介孔氧化硅微球的合成及其在化学机械抛光中的应用[J].硅酸盐学报,2016,44(09):1357-1364.DOI:10.14062/j.issn.0454-5648.2016.09.17.
基金信息:
国家自然科学基金(51205032,51405038,51575058)资助
2016-08-30
2016-08-30
2016-08-30