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5G微带天线、毫米波雷达等应用领域要求所使用的印制电路板(PCB)具有集成化、微型化的特点，这通常要求介质基板材料具有高的介电常数(Dk)，低的介电损耗(Df)以及趋近于零的介电常数温度系数(α)。将电介质陶瓷填充到有机聚合物中制备的复合基板兼具良好的加工性和优异的介电性能，是目前最有前途的解决方案。然而，陶瓷填料的物化指标、介电性能以及其与有机树脂的相容性常常是影响有机/无机复合材料综合性能的关键因素。选取具有优异介电性能的二氧化钛(TiO2:Dk约为110,Df约为0.001,α约为–700×10–6℃–1)作为研究对象，利用水热法合成了纳米级TiO2前驱体，通过特殊的球化技术制得了高球形度、高结晶度的微米级球形二氧化钛填料。对TiO2填料进行表面改性处理，极大地改善了填料与有机树脂的相容性。此外，通过掺杂Al_2O3调控了TiO2填料的α，当填料中Al_2O3的质量分数为20%时，所制备复合基板综合介电性能优异：在25℃，10 GHz下的Dk=10.2,Df=0.001 9,α=–405×10–6℃–1。上述研究结果表明所制备的陶瓷填料能够满足在5G高频高介电PCB板领域的实际应用。
Abstract：Printed circuit boards (PCBs) are usually required to be integrated and miniaturized by a variety of applications,such as 5G microstrip antenna and millimeter wave radar,which require the used dielectric substrate materials with a low dielectric loss (Df) and a high dielectric constant (Dk).The composite substrate prepared by filling dielectric ceramics into organic polymers has good machinability and superior dielectric properties,which is regarded as the most promising solution.However,the physical and chemical indexes,dielectric properties of the ceramic filler and its compatibility with organic resins are three key factors affecting the comprehensive properties of organic/inorganic composites.In this paper,a micron-spherical filler with a high sphericity and a high crystallinity was prepared by a special spheroidization technology with titanium dioxide material with superior dielectric properties(i.e.,Dk≈110,Df≈0.001,dielectric constant temperature coefficient (α)≈–700×10–6℃–1).The compatibility between the filler and organic resin is improved after the surface modification of TiO2 filler.Also,the dielectric constant temperature coefficient of TiO_2filler is regulated by Al_2O3 doping.The composite substrate filling with 20%(in mass) Al_2O3 exhibits the superior properties (i.e.,Dk=10.2,Df=0.001 9,and α=–405×10–6℃–1).This indicates that the as-prepared ceramic filler has the promising characteristics for potential applications of 5G high-frequency,high-dielectric PCBs.
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基本信息:
DOI：10.14062/j.issn.0454-5648.20230275
中图分类号:TB332
引用信息:
[1]禹在在,李伶,刘建,等.微米级球形TiO_2的制备及其树脂基复合材料的高频介电性能[J].硅酸盐学报,2023,51(10):2634-2643.DOI:10.14062/j.issn.0454-5648.20230275.
基金信息:
国家重点研发计划资助(2022YFB3706300)
2023-09-20
2023-09-20
2023-09-20