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采用Ti活性中间层对ZrC--20%SiC复合陶瓷进行扩散焊连接,研究了活性元素Ti与复合陶瓷的界面反应机理,分析了焊接温度对接头微观组织以及力学性能的影响。结果表明:Ti与复合陶瓷发生界面反应,首先形成TiC化合物层,部分反应中间产物Zr原子固溶于TiC化合物中,其余部分扩散进入Ti中间层,形成固溶体;延长反应时间或提高焊接温度,Ti进一步与反应中间产物Zr、Si原子在靠近陶瓷一侧生成Ti--Zr--Si三元相,同时增加界面反应层的厚度。焊接接头的剪切强度随温度由900℃升高到1 200℃先提高后降低,在压力为20MPa及1 000℃保温30min条件下,达到最大值(149MPa)。
Abstract：ZrC--20%SiC composite ceramic(ZS)was bonded with a pure Ti interlayer.The typical microstructure and interfacial reaction mechanism of the ZS/Ti/ZS joint were analyzed.The effect of bonding temperature on the interfacial microstructure and mechanical property was investigated.The results show that the TiC compound is formed at the interface due to the interaction between Ti and ZrC--SiC composite.The atoms of Zr and Si release as the intermediate products.A portion of Zr atoms are diffused into the TiC layer and the remains are diffused into the Ti interlayer as solid solution atoms.The Ti--Zr--Si phase is formed nearby the ZrC--SiC composite at a higher bonding temperature or a longer bonding time.The thickness of the formed reaction layer increases.The shear strength of the diffusion bonded joints firstly increases and then decreases when the bonding temperature increases from 900℃to 1 200℃.The maximal value is 149MPa when bonded at 1 000℃ under 20MPa for 30min.
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基本信息:
中图分类号:TG407;TG453.9
引用信息:
[1]宋昌宝,林铁松,何鹏,等.ZrC--SiC复合陶瓷扩散焊接头界面组织及力学性能[J].硅酸盐学报,2014,42(03):275-279.
基金信息:
国家自然科学基金(50975062,51275135,51021002)资助项目
2014-03-04
2014-03-04
2014-03-04